Multi-level SMD stencils 

Multi-level stencils are used for applications which require different thicknesses of solder paste coatings on a single stencil. This ensures the quantity control of solder paste for each component separately and helps achieve optimal application of solder paste to the printed circuit board. 

General information: 

• The thinnest part 80 μm thick 
• The thickest part 300 μm thick 

• Possible combination of different thicknesses on one stencil from 80 to 500 μm .

Material:

• Standard material SUS 304 thickness: 80, 90, 100, 110, 120, 130, 140, 150, 180, 200, 250 and 300 µm
• FineGrain material thickness: 80, 90, 100, 110, 120, 130, 150, 180, 200 and 250 µm

Technical information: 

• Position accuracy for sections is less than 10 μm 
• Cutting accuracy along the axial axis is + – 2 μm 
• Material thickness tolerance is 2% 
• The working surface on which the sections can be of different thicknesses is 440 x 730 mm 

We produce stencils for pneumatic frames: Zelflex, Quattro flex, DEK, Alpha, Mechatronic, etc. 

Material:

• Standard material SUS 304 thickness: 80, 90, 100, 110, 120, 130, 140, 150, 180, 200, 250 and 300 μm
• FineGrain material thickness: 80, 90, 100, 110, 120, 130, 150, 180, 200 and 250 μm

The following sizes are available: 

• 400 x 500 mm
• 500 x 500 mm
• 555 x 555 mm
• 550 x 650 mm
• 584 x 584 mm
• 736 x 736 mm

The following sizes are available: 

• 584 x 1200 mm
• 584 x 1800 mm
• 736 x 980 mm
• 736 x 1500 mm
• 736 x 1800 mm

Different dimensions available by arrangement. .

Different dimensions available. Prototype stencils are intended for manual application of solder paste on a printed circuit board. 

Material: 

• Standard material SUS 304 thickness: 80, 90, 100, 110, 120, 130, 140, 150, 180, 200, 250 in 300 μm
• FineGrain material thickness: 80, 90, 100, 110, 120, 130, 150, 180, 200 in 250 μm